Issue 31

A.R. Maligno et alii, Frattura ed Integrità Strutturale, 31 (2015) 97-119; DOI: 10.3221/IGF-ESIS.31.08 114 Figure 24 : Analytical solution for K (bending stress 1 MPa). Figure 25 : Stage-3 crack configuration. In Fig. 26 the profile of the inside-wall crack growing through the thickness in the casing pipe (while no further crack growth happens in the Conductor pipe) is presented. Figure 26 : Detail of residual ligament in conductor. Stage 3: Numerical results The number of cycles necessary for the thickness node to reach the external surface of the casing and the effect of crack depth on the stress intensity factor are presented respectively in Figs. 27 and 28.