Issue 19

L. Kunz et alii, Frattura ed Integrità Strutturale, 19 (2012) 61-75; DOI: 10.3221/IGF-ESIS.19.06 70 Based on the observation of the dislocation structures near the crack tip in Cu, the following considerations can be made. At high crack growth rates and relatively small grain size the “fracture mechanical” plastic zone consisting of cell structure is large compared to the length of PSBs, which develop before the propagating crack tip. The plastic strain amplitude at the crack tip controls the crack growth process. However, for low crack growth rates and coarse-grained Cu the ratio of the length of PSBs terminating on the grain boundaries to the cell zone size increases. Some observations show that the cell zone can vanish completely in the near threshold crack growth conditions. The decisive majority of the cyclic plastic strain is concentrated in the PSBs. This type of plastic zone is different from the fracture mechanical zone, which develops at loading with high K a . It is obvious that this effect and effect of grain size can influence the crack growth rate. Now, UFG Cu produced by ECAP has a typical grain size (cell size) of about 300 nm. This is comparable to the smallest cells observed at the tip of a fatigue crack propagating at the conditions characterized by K a ~ 10 MPa√m [35]. From this point of view, the crack propagation resistance of UFG and CG copper in this region should be similar; strong differences, however, can be expected in the threshold region. Here the stability of UFG structure would play a decisive role. A study of the crack propagation in UFG Cu prepared by high pressure torsion is reported in [36]. The crack propagation was studied on very thin specimens loaded in gigacycle region at ultrasonic frequency. The researchers observed a very intensive grain coarsening in the vicinity of the fatigue crack in Cu of high purity. The retardation of the crack growth was reported and explained just by this effect. The resistance to the propagation of long cracks in UFG copper determined experimentally on round compact tension specimens is presented in Fig. 14. The form of the plot is the traditional log-log ( da/dN;  K=K max - K min ) diagram. Figure 14 : Fatigue crack growth curves for 8-ECAPed UFG copper. Different load ratios R = K min /K max were used in experiments. Other data from the literature are plotted for comparison. In particular, these last are: i) fatigue crack growth (FCG) curve at R = 0.25 of pure UFG Cu ECAPed by 4Bc passes with grain size d G = 270 nm [37]; ii) FCG curve at R = 0.5 of UFG Cu 4Bc passes and d G = 300 nm [38]; iii) FCG curve at R = 0.5 of UFG Cu 16A ECAP with d G = 300 nm [38]; iv) FCG plot at R = 0.5 of CG copper with d G = 15  m [1]. From the analysis of data it follows that - as for the conventional metals - points in stage II of propagation, can be fitted by the classical Paris law:   / m da dN C K   (4) with C and m coefficients depending on R -ratio: C = 7.72x10 -10 , 3.75x10 -8 , 1.10x10 -7 , 4.10x10 -7 and m = 3.54, 2.32, 1.90, 1.36 at R = 0.1, 0.3, 0.5, 0.7 respectively.