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Two different fracture mechanisms of brittle thin films on compliant substrateshave been observed, one with interfacial delamination and the other with substratepenetration. Using a set of finite element models, we analyze the effects ofdelamination and penetration on channel cracking of brittle thin films. Thecompetition between delamination and penetration is examined with respect to thetoughness ratio between the substrate and the interface as well as the elasticmismatch. A cohesive zone model is developed to simulate initiation and growthof delamination or penetration cracks from the root of a channel crack.