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Reliability of interface junctions is the key problem in many industrial applications. To model adhesion, strength and fracture parameters of interface junctions the multiscale crack bridging concept is used. In the frames of this concept is supposed: there are bonds of the different scales (intermolecular forces, molecular bundles, fibers, nanofibers) between joined materials (the interface layer); any zone of weakened bond in this layer is considered as the interface crack with distributed nonlinear spring-like bonds between the crack surfaces (bridged zone). The bonds properties on the different scales define the stress state at the crack bridged zone and, hence, the reliability and the fracture toughness of the interface junction. In a general case, the size of bridged zone of the interface crack is comparable to the whole crack size.