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Printed Circuit Boards (PCBs) are frequently exposed to a very complex combination of external and internal thermo-mechanical loads (static, cyclic and impact loads superimposed onto local and global temperature effects). Instrumented impact tests were performed in this study to characterize the failure behavior of these boards. In addition to the acceleration measurement at the impact the deformation behavior was analyzed using a high speed camera. Furthermore, monotonic fracture tests were performed on a selected model material to determine fracture toughness parameters both in terms of single and multiple fracture mechanics parameters and cohesive zone models, using two different specimen configurations. In addition to the global load-displacement curves, non-contact full-field strain analysis was performed and the near and far field strain distribution determined. Based on these measurements adequate crack tip opening displacement, crack extension data and crack tip stress values were calculated. These results will be used for further numerical simulation of the deformation and failure behavior of PCBs.